スマートフォン部品・材料の技術と市場/手塚博昭(著者),川田宏之(編者),柏尾南壮(編者)

  • Auction ends10/07/2024 10:05 AM (Tokyo)
  • Current Time09/30/2024 10:05 AM (Tokyo)
  • Bids0
  • Availability 1 pcs
  • Leading Bidder
  • VAT Tax: 10 %
  • Return Policy: Not possible
  • Item condition: USED20
  • Shipping in Japan: Free
  • Auction ID: x1080921909
  • Automatic Extensionfalse
  • Item location: 神奈川県
  • Seller items: bookoff2022_2nd All seller's items
  • Seller's Rating: 83067
  • Current Price

    ¥28,600 (~$205)

    (¥31,460 including tax)

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  • Buyout Price

    ¥28,600 (~$205)

    (¥31,460 including tax)

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  • Time left