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    • [A11819268]セラミック多層配線基板―超LSIパッケージ/マルチチップモジュール基板技術 [単行本] 大塚寛治

    • Auction ends12/22/2024 18:09 PM (Tokyo)
    • Current Time12/15/2024 18:09 PM (Tokyo)
    • Bids0
    • Availability 1 pcs
    • Leading Bidder
    • VAT Tax: 10 %
    • Return Policy: Not possible
    • Item condition: USED40
    • Shipping in Japan: Free
    • Auction ID: s1125394410
    • Automatic Extensionfalse
    • Item location: 大阪府
    • Seller items: books_dream All seller's items
    • Seller's Rating: 32758

    • Current Price

      ¥5,445 (~$37)

      (¥5,989 including tax)

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    • Buyout Price

      ¥5,445 (~$37)

      (¥5,989 including tax)

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    • Time left

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